30th October 2026 – (Hong Kong) Mainland semiconductor assembly and testing provider Jiangsu Silicon Integrity Semiconductor Technology (07672) opened its Hong Kong public offer on Friday, seeking as much as about HK$1.02 billion to build production capacity and deepen advanced packaging research.
The offer runs from 30th October to noon on 5th November, with an indicative price of HK$8.60 to HK$9.60 a share. Boards of 500 shares carry an entry ticket of about HK$4,848.41 including fees. Huatai International is sole sponsor. About 106.5 million H shares are on offer, with roughly 90 per cent for international placing and 10.656 million shares, or about 10 per cent, for the Hong Kong public tranche. At HK$9.60, the whole deal would raise about HK$1.023 billion.
If international demand falls short while Hong Kong is fully or oversubscribed, or if both tranches are fully or oversubscribed, about 5.237 million shares may shift from the international book into Hong Kong, lifting the local tranche to about 15.984 million shares, with the final price then set at the HK$8.60 floor.
Founded in September 2020, the group has built mass-production capability across traditional and advanced packages. Frost & Sullivan figures cited by the company cover BGA, LGA, WLP, 2.5D/3D, FC-QFN and FC-SOT alongside traditional WB-QFN. By 2025, advanced packaging and testing revenue it ranked seventh among mainland general OSAT firms with a 0.6 per cent share.
Revenue climbed from Rmb509 million in 2023 to RMB827 million in 2024 and RMB1.012 billion in 2025. The first four months of this year brought RMB359.7 million, up 17.4 per cent year on year, though the period still posted a Rmb161.9 million loss and a 17.9 per cent gross-loss margin, 2.6 percentage points narrower than a year earlier.
About 69.5 per cent of proceeds is planned for production bases, new lines and related equipment; about 17.6 per cent to lift advanced packaging R&D and competitiveness, including the Chiplet and Advanced Package integration Center platform; about 2.9 per cent to strengthen commercial reach and customer collaboration; and about 10 per cent for working capital and general corporate uses.
 opened its Hong Kong public offer on Friday, seeking as much as about HK$1.02 billion to build production capacity and deepen advanced packaging research.){kind=link}