17th January 2020 – (Japan) According to Small Tech News, Japan’s NTT Group’s equipment technology laboratory successfully developed a 6G ultra-high-speed chip recently, using phosphated carp (InP) compounds, and in the 300GHz ultra-high frequency band of wireless transmission experiments, using 16QAM modulation, obtained 100Gbps ultra-high speed, equivalent to 100,000 megabit wired network.
Even more impressive, this high-speed only uses a carrier, if supplemented by multi-carrier aggregation, as well as MIMO, OAM and other space reuse technology, or the future development of new related technologies, the combination of speed is even more unlimited, is expected to reach at least 400 Gpbs, that is, 5G speed today at least 40 times.
Of course, 28GHz mmwave is faced with the transmission distance, loss of the severe test, 300GHz UHF needs to overcome more difficulties, and is destined to only be suitable for short-range high-speed transmission.
Prior to that, nCIC Labs at the University of California, Irvine, also developed a transceiver chip that exceeds 5G, manufactured by the 55nm SiGe BiCMOS process, measuring 2.5 x 3.5 mm and operating in the 115-135GHz band, with a successful 36Gbps wireless transmission speed. But the distance is only 30 cm.
As for what 6G will look like, no one counts, and what is being done is to explore the possibilities.